RF-DFN Chip Packaging

LF Chip: NXP Hitag, EM4200, CET 5577 etc.

HF Chip: ISO 14443A, NFC, 15693 etc.

UHF Chip: Impinj Monza M4QT, MR6, MR6P, M730, M750 etc. NXP UCODE 8, UCODE 9 etc.

LOW MOQ up to 1 wafer in 8" size

Series Mini Dimensions

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  • Overview
  • Features

Overview

  • DFN chip package, widely used in RFID tag manufacturing, which needs high temperature SMT soldering process to bond RFID chip and antenna firmly.

  • Nowadays, high MOQ and longer lead time are normal in semiconductor packaging industry, which also caused longer term for new product development.

  • RF-DFN chip packaging service can quickly help you to encapsulate various RFID chips. Creating more powers and opportunities for RFID/IOT industry.

Specification

  • ※ D2216-2P 2.2×1.6×0.55mm 2 PIN
    ※ D2121-4P 2.1×2.1×1.0mm 4 PIN
    ※ D3528-6P 3.5×2.8×0.7mm 6 PIN
    ※ S3015-4P 3.0×1.5×0.9mm 4 PIN

Features

  • ※ Fast delivery with professional packaging
    ※ Low MOQ up to 1 wafer in 8’’ size
    ※ Quick and professional service response
    ※ Wide range of RFID chip types
    ※ Series Mini Dimensions
    ※ Fast and cost-effect proofing
    ※ Suitable to high temperature resistant SMT process

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