As a leading payment industrial event Banking Day 2025, which was successfully held at global semiconductor giant Infineon headquarters in Munich during 24- 25th Sep.2025.
ReadFind IoT is honored to be official partner to participate such great event and present the new NFC wearable product like NFC Rings in Ceramic and Metal, to serve the booming mobile payment application in global market.
Banking Day event is annual grand gathering of technology and creativity not only showcased the latest trends in the financial industry but also served as a vital platform for driving innovation in smart payment solutions.
At this event, ReadFind IoT came into the spotlighting by presenting its next generation NFC wearables product and metal card solutions, which attracted widespread attention. Thanks Infineon’s SECORA Connect chip solutions and SECORA Pay dual-interface module (COM), integrates high-level security, elegant design, and multi-functionality, representing the cutting edge of NFC wearables and smart card technologies.
Infineon and Ecosystem Partners Co-Create the Future Blueprint
As the host of the event, Infineon showcased its latest achievements in chip technology, intelligent connectivity, and low-carbon digital transformation. The company emphasized its commitment to deepening collaboration with ecosystem partners to jointly advance the intelligent and secure development of financial technology.
ReadFind IoT’s presence at the event not only demonstrated its technological strength but also highlighted its close collaboration with Infineon in emerging payment solutions. Looking ahead, as payment methods continue to evolve and user demands grow, innovative payment product form factors like NFC wearables, metal cards are expected to see broader adoption across global markets.